The rumored Sept. 12 iPhone 5 debut is around the corner, but rumors are still surfacing. iFans have been treated to speculations that have scrutinized everything from the iPhone's 5 parts, the USB cable, the Nano-SIM, the fully-assembled parts, and even the packaging. Conjectures about the processor have finally made it to the list.

On Thursday, Aug. 30, Sonny Dickson released a set of new photos that revealed the iPhone 5's alleged motherboard. The images are suspiciously similar to the logic board photos which surfaced a few weeks back. However, the leaked photos distinctly show that "A6" is printed on the motherboard's main chip, fueling speculations that Apple intends to roll out a new system-on-a-chip or SoC for its next-gen iPhone.

"The crisp picture shows the logical board without any protective EMI shielding for an internal look at the A6 chip that supposedly sits inside," reported 9to5Mac.

The leaked images are small in size and, therefore it is difficult to discern the A6 chip's presence. Apparently, according to 9to5Mac, Dickson admitted that the images were "enhanced with Photoshop", raising questions about their authenticity.

In July, DigiTimes reported that a Samsung Exynos 4 processor would likely power the iPhone 5. However, tech gurus opined that Apple would take the SoC solution route, which it introduced in 2010 with its A4 chip variant. The A4 chip powers the first-generation iPad, iPhone 4, fourth-generation iPod Touch, and second-generation Apple TV. By contrast, the iPhone 4S and new iPad feature variants of the A5X, which is a dual-core processor with quad-core graphics.

The rumored A6 chip is believed to be a quad-core processor, which is capable of handling several applications and simultaneous activities in an effective manner.

The purported A6 chip's images can be checked out here.