It took Taiwanese firm MediaTek seven months to launch the Helio X30 system-on-chip from the time it unveiled the SoC in August 2016. Following the Soc’s roll out at the Mobile World Congress 2017 in Barcelona, Spain, the company said the first smartphones powered by the SoC would be released in Q2 2017.

10nm Manufacturing Process

As MediaTek’s most powerful SoC, Helio X30 would be used on high-end gadgets, Android Authority reports. To create the SoC, MediaTek used a 10nm manufacturing process and a design based on cores made of three clusters.

The new SoC needs 50 percent less lower but offers 35 percent performance boost compared to the older Helio X20 SoC. The Helio X30 has two ARM Cortex-A7s cored clocked at 2.5GHz, four ARM Cortex-A53 cores clocked at 2.2GHz, and four ARM Cortex-A35 cores that run at 1.9GHz. Its CPU could support three downlink Carrier Aggregation and two uplink Carrier Aggregation for streaming content with high volume.

The Imagination PowerVR Series 7XT Plus GPU is part of the Helio 30X SoC, clocked at 800MHz and 2.4 times faster and 60 percent more efficient in energy use compared to the Helio X20. It could support screens of up to 2,560 x 1,600 pixels, up to 8GB of RAM, and it incorporates to 14-bit image signal processors that support 16+16MP dual cameras.

CorePilot 4.0 Included

AnandTech adds that the Helio 30X SoC comes with the CorePilot 4.0 to manage CPU frequency and scheduling of tasks. Since its tri-cluster CPU configuration is optimized, the CorePilot monitors the power budget of the chip by migrating tasks between clusters.

In migrating tasks, the basis of the CorePilot that comes with the Helio 30X SoC are workload and user experience parameters such as frame per second. The CorePilot likewise adjusts the CPU frequency by using Fast DVFS technology which increases sampling rate and allows faster voltage/frequency adjustments which follow better the changes in workload.